Intel Eyes an Opening in Taiwan Semiconductor's AI Packaging Fortress

Intel Corp. (NASDAQ: INTC ) is stepping up its push into advanced chip packaging as it seeks to challenge Taiwan Semiconductor Manufacturing Company Ltd.’s (NYSE: TSM ) dominant position in a fast-growing AI hardware market where demand for more efficient links between processors and memory continues to rise. Counterpoint Research analyst Neil Shah sees Intel’s chip-packaging strategy as a potential way to challenge Taiwan Semiconductor in the fast-growing AI hardware market, although he believes Intel still needs strong execution, customer support and manufacturing scale to close the gap. Intel Targets a New AI Battleground Shah said on Tuesday that he expects more than 130 million GPUs and custom AI accelerators to ship with advanced memory packaging over the next five years, generating nearly $2 trillion in computing revenue.