Applied Materials, Inc. (AMAT) Discusses DRAM and Advanced Packaging Innovations for AI-Driven Semiconductor Growth Prepared Remarks Transcript

SA Transcripts 160.96K Followers Follow 5 Share Save Comments Play Earnings Call Play Earnings Call Applied Materials, Inc. ( AMAT ) Discusses DRAM and Advanced Packaging Innovations for AI-Driven Semiconductor Growth June 25, 2026 12:00 PM EDT Company Participants Michael Sullivan - Corporate Vice President of Investor Relations Kevin Moraes Sony Varghese Jinho An Lior Engel Presentation Michael Sullivan Corporate Vice President of Investor Relations Hello, and welcome back to the Applied Materials Master Class series. Several years ago, we anticipated that the AI wave would drive the semiconductor industry to $1 trillion in annual sales by 2030. And through that time, we modeled the wafer fab equipment market composition to be around 1/3 leading-edge, foundry-logic, 1/3 ICAPS and 1/3 memory, with memory evenly divided between DRAM and NAND. Today, we see AI driving the semiconductor industry to around $1 trillion this year and new incremental applications like agentic, edge and physical AI growing the industry to much higher levels over the next several years. These AI waves are fueling demand for faster, more energy-efficient chips and systems, and this is creating a new WFE spending mix. We now expect leading-edge, foundry-logic to outgrow ICAPS and drive well over 50% of foundry-logic in the years ahead. And in memory, we expect DRAM WFE spending to be well over 2x NAND spending. Applied is well positioned for this new mix with the highest process equipment market share in leading-edge, foundry-logic, which we covered in our April master class as well as both DRAM and advanced packaging, which we're covering today. In a moment, Kevin Moraes will summarize our strategy and explain why DRAM and advanced packaging are growing with AI. Next, Sony Varghese will share the road map for both standard DRAMs and high-bandwidth memories. Then Jinho An will discuss how advanced packaging is enabling faster and more energy-efficient AI chips and systems. Next, Lior Engel will explain how we are bringing eBeam process control to advanced packaging. Finally, Kevin