Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes

Nova announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection followed a competitive evaluation, resulting in the Nova WMC™ being designated as tool-of record. The selection is expected to support multiple advanced packaging production flows, and to position Nova for further deployment opportunities as the customer expands production capacity. In addition to this recent win, Nova noted an accelerating adoption of the WMC™, with deployments across several memory and foundry customers. The strong demand for Nova WMC™ reflects the platform's unique, modular design and customizable architecture, which enable it to address key challenges such as high warpage, non-symmetric shapes, and different surface conditions within a single tool. The platform delivers high throughput alongside fast, repeatable scanning with large-area mapping at nanometer-level fidelity. "Following a successful introduction, Nova WMC™ is now entering a rapid growth phase," said Gaby Waisman, President and CEO of Nova Ltd. "Customer adoption across advanced packaging and HBM applications underscores the platform's value and positions us to scale as demand accelerates. This latest selection by a leading customer, further expands its adoption of our portfolio, reinforcing our position as a trusted partner." About Nova Nova is a leading innovator and key provider of material, optical and chemical solutions for advanced metrology and process control in semiconductor manufacturing. Nova delivers continuous innovation by providing state-of-the-art, high-performance solutions for effective process control throughout the semiconductor fabrication lifecycle. Nova's product portfolio, which combines high-precision hardware and cutting-edge software, provides its customers with deep insight into developing and producing the ...